The Arkfly Conweb Cool Plate from Phaetus offers Low-Temperature Adhesion – excellent adhesion without a heated bed. The build plate uses a microporous polymer membrane that generates transient adsorption forces through molecular interface technology. This enables reliable adhesion to the print object even at room temperature without thermal activation.
The integrated Flex Release technology with a side-mounted, thermally insulated handle enables the printed object to be removed easily and safely with just one hand. An AR code on the surface supports precise alignment and minimizes operating errors.
► The build plate has a fine, smooth texture on both sides and a self-regenerating coating that ensures durability.
Structure of the Cool Plate:
- microporous polymer membrane to support the adhesive effect and cold adsorption,
- HRC50+ hardened spring steel core for stability and flexibility,
- microporous polymer membrane to support the adhesive effect and cold adsorption.
Tip: Cleaning the Cool Plate with soap and water is recommended.
Recommended printing temperature:
| Material | AFI (Adhesion Force Index) | Recommended printing temperature |
| PLA | 10 | 30-50 °C |
| PETG | 10 | 60-80 °C |
| ABS | 10 | 100-110 °C (adhesive required) |
| PA | 9 | temperature recommended by the manufacturer (adhesive required) |
| PA-CF | 8 | temperature recommended by the manufacturer |
| ABS-CF | 8 | temperature recommended by the manufacturer |
| ABS-GF | 9 | temperature recommended by the manufacturer |
| PET-CF | 8 | temperature recommended by the manufacturer |
| TPU | not compatible | – |
DIY Pricing: Support Not Included
To keep our part prices as low as possible, this item does not include technical support.
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